Ọnụ ego ịtụ | ≥1 PCS |
Ogo ogo | IPC-A-610 |
Etiti oge | 48H maka ngwa ngwa; |
4-5 ụbọchị maka prototype; | |
Ọnụ ọgụgụ ndị ọzọ na-enye mgbe a na-ehota ihe | |
Nha | 50*50mm-510*460mm |
Ụdị bọọdụ | Isi ike |
Na-agbanwe agbanwe | |
Isi ike-mgbanwe | |
Isi igwe | |
Ngwungwu min | 01005 (0.4mm*0.2mm) |
Ịkwado nke ọma | ± 0.035mm (± 0.025mm)Cpk≥1.0 |
Emecha elu elu | Lead/duo HASL efu, ọla edo imikpu, OSP, wdg |
Ụdị Mgbakọ | THD (Ngwaọrụ Thru-hole) / Mgbakọ |
SMT (teknụzụ n'elu ugwu) | |
Ngwakọta SMT & THD | |
Mgbakọ SMT na/ma ọ bụ THD nwere akụkụ abụọ | |
Isi mmalite nke akụrụngwa | Turnkey(Ihe niile nke ANKE nwetara), igodo akụkụ akụkụ, ebufere |
ngwugwu BGA | BGA Dia 0.14mm, BGA 0.2MM Pitch |
Nkwakọ ngwaahịa akụrụngwa | Reels, bee teepu, Tube, Tray, rụrụ akụkụ |
Mgbakọ USB | Cable omenala, mgbakọ USB, wiring/harness |
Stensụl | Stencil nwere ma ọ bụ enweghị etiti |
Chepụta usoro faịlụ | Gerber RS-274X, 274D, Ugo na AutoCAD's DXF, DWG |
BOM (Ụgwọ ihe onwunwe) | |
Họrọ na ebe faịlụ (XYRS) | |
Nyocha ogo | Nyocha X-ray, |
AOI (Onye nyocha anya akpaaka), | |
Nnwale na-arụ ọrụ (ekwesịrị ịnye modul ule) | |
Nnwale ọkụ | |
Ike SMT | 3 Nde-4 Million soldering pad kwa ụbọchị |
Ikike DIP | 100 puku pin / ụbọchị |
Oge nzipu: Sep-05-2022