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manfactyre

Ọnụ ego ịtụ ≥1 PCS
Ogo ogo IPC-A-610
Etiti oge 48H maka ngwa ngwa;
4-5 ụbọchị maka prototype;
Ọnụ ọgụgụ ndị ọzọ na-enye mgbe a na-ehota ihe
Nha 50*50mm-510*460mm
Ụdị bọọdụ Isi ike
Na-agbanwe agbanwe
Isi ike-mgbanwe
Isi igwe
Ngwungwu min 01005 (0.4mm*0.2mm)
Ịkwado nke ọma ± 0.035mm (± 0.025mm)Cpk≥1.0
Emecha elu elu Lead/duo HASL efu, ọla edo imikpu, OSP, wdg
Ụdị Mgbakọ THD (Ngwaọrụ Thru-hole) / Mgbakọ
SMT (teknụzụ n'elu ugwu)
Ngwakọta SMT & THD
Mgbakọ SMT na/ma ọ bụ THD nwere akụkụ abụọ
Isi mmalite nke akụrụngwa Turnkey(Ihe niile nke ANKE nwetara), igodo akụkụ akụkụ, ebufere
ngwugwu BGA BGA Dia 0.14mm, BGA 0.2MM Pitch
Nkwakọ ngwaahịa akụrụngwa Reels, bee teepu, Tube, Tray, rụrụ akụkụ
Mgbakọ USB Cable omenala, mgbakọ USB, wiring/harness
Stensụl Stencil nwere ma ọ bụ enweghị etiti
Chepụta usoro faịlụ Gerber RS-274X, 274D, Ugo na AutoCAD's DXF, DWG
BOM (Ụgwọ ihe onwunwe)
Họrọ na ebe faịlụ (XYRS)
Nyocha ogo Nyocha X-ray,
AOI (Onye nyocha anya akpaaka),
Nnwale na-arụ ọrụ (ekwesịrị ịnye modul ule)
Nnwale ọkụ
Ike SMT 3 Nde-4 Million soldering pad kwa ụbọchị
Ikike DIP 100 puku pin / ụbọchị

 


Oge nzipu: Sep-05-2022