| Ọnụ ego ịtụ | ≥1 PCS |
| Ogo ogo | IPC-A-610 |
| Etiti oge | 48H maka ngwa ngwa; 4-5 ụbọchị maka prototype; Ọnụ ọgụgụ ndị ọzọ na-enye mgbe a na-ehota ihe |
| Nha | 50*50mm-510*460mm |
| Ụdị bọọdụ | Isi ike Na-agbanwe agbanwe Isi ike-mgbanwe Isi igwe |
| Ngwungwu min | 01005 (0.4mm*0.2mm) |
| Ịkwado nke ọma | ± 0.035mm (± 0.025mm)Cpk≥1.0 |
| Emecha elu elu | Lead/duo HASL efu, ọla edo imikpu, OSP, wdg |
| Ụdị Mgbakọ | THD (Ngwaọrụ Thru-hole) / Mgbakọ SMT (teknụzụ n'elu ugwu) Ngwakọta SMT & THD Mgbakọ SMT na/ma ọ bụ THD nwere akụkụ abụọ |
| Isi mmalite nke akụrụngwa | Turnkey(Ihe niile nke ANKE nwetara), igodo akụkụ akụkụ, ebufere |
| ngwugwu BGA | BGA Dia 0.14mm, BGA 0.2MM Pitch |
| Nkwakọ ngwaahịa akụrụngwa | Reels, bee teepu, Tube, Tray, rụrụ akụkụ |
| Mgbakọ USB | Cable omenala, mgbakọ USB, wiring/harness |
| Stensụl | Stencil nwere ma ọ bụ enweghị etiti |
| Chepụta usoro faịlụ | Gerber RS-274X, 274D, Ugo na AutoCAD's DXF, DWG BOM (Ụgwọ ihe onwunwe) Họrọ na ebe faịlụ (XYRS) |
| Nyocha ogo | Nyocha X-ray, AOI (Onye nyocha anya akpaaka), Nnwale na-arụ ọrụ (ekwesịrị ịnye modul ule) Nnwale ọkụ |
| Ike SMT | 3 Nde-4 Million soldering pad kwa ụbọchị |
| Ikike DIP | 100 puku pin / ụbọchị |
